从设计角度看，EMIB-T不再局限于简单的2.5D互连，而是向3D封装技术Foveros靠拢，使得在更大芯片尺寸下实现高密度集成成为可能，为未来异构计算平台提供灵活封装架构。
Александра Синицына (Ночной линейный редактор)
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Google VP warns that two types of AI startups may not survive
"I was reading a magazine article on the Gemini astronauts. I was probably nine years old, and I thought that's the coolest thing. That's what I want to do," she says.